AMD X570 Chipset
The AMD X570 chipset is designed around third-generation AMD Ryzen 3000-series processors. Along with multiple noteworthy improvements, the design supports PCIe 4.0, which has roughly double the bandwidth of PCIe 3.0. This benefits graphics cards, networking devices, NVMe drives, and more.
Thermal pads quickly transfer heat to the VRM and Active Chipset heatsinks, which are cooled by dual fans to help keep high temperatures from causing damage. Additionally, the included M.2 heatsink is designed to keep the SSD working at the optimal temperature for consistent performance. The motherboard also features a strong backplate that prevents bending and an 8-layer PCB that quickly dissipates heat from critical components. This provides overall system stability while leaving headroom for overclocking components such as the CPU.
Back Panel I/O
Front Panel I/O