With upgraded power delivery and comprehensive cooling options to fuel the latest Intel® CPUs, plus support for faster memory and storage, TUF GAMING H470-PRO (WI-FI) is the perfect foundation for your next high-core-count battle rig.
Stack Cool 3+
2-ounce copper layers draw heat away from critical components to keep them at their optimal operating temperatures and provide more headroom to push CPUs beyond stock speeds.
Certified military-grade TUF chokes deliver rock-steady power to the CPU, improving system stability.
Proprietary capacitors provide up to 20% greater temperature tolerance and 5X-longer lifespan.
Certified military-grade MOSFETs with lower RDS(on)*.
The integrated Digi+ VRM voltage-regulator module (VRM) is one of the finest in the industry, ensuring ultra-smooth and ultra-clean power delivery to the CPU at all times.
Cooler by design
1. VRM HEATSINK
A large, high-mass heatsink with extensive surface that covers the VRM and choke areas improves heat dissipation.
High-quality thermal pads help transfer heat from the inductor and phase array to the heatsink.